Microwave Marketing

CICOR Microelectronics appoint MM as Exclusive UK Agent

 

Cicor Microelectronics for Thin Film ccts, Thick film ccts, 20 Layer PCBs, 3D-MID

Effective from 1st Jan 2012, Microwave Marketing are pleased to announce that they have been appointed as the UK Representative for Cicor Microelectronics.  

This strengthens Microwave Marketing’s position as the prime supplier of RF and microwave components in the UK.  

Cicor is a globally active group of leading companies in the electronics industry.

The group's companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, 3D-MID solutions, hybrids and electronic modules. Cicor Microelectronics is the leading manufacturer of sophisticated microelectronic, including thin film and thick film circuits, assembly, packaging and test/screening. Their innovative technologies enable the realization of customer-specific product solutions of the highest level.

Furthermore, these state of the art technologies are available with no ITAR restrictions.  

Cicor Microelectronics offer:

·         Highly specialized technologies for thin film and thick film applications

·         Availability of all assembly and interconnect technologies

·         Fast production of prototypes

·         Delivery of tested and qualified component module  

 

3 D Moulded Interconnect

Another innovation from Cicor is the introduction of 3D-MID (3 Dimensional Moulded Interconnect Device). For the first time, it is now possible to combine mechanical and electronic functions in the smallest of spaces. With its own technology centre, which combines all the process steps under a single roof, Cicor has perfected its offerings.

By integrating mechanical and electronic functions and three-dimensional design the optimal usage of space is achieved. Moreover, large scale integration density of mechanical and electronic functions is possible and savings can be made on components and process steps. In turn, this affords a high degree of design flexibility. The technology is suitable for low frequency electronic solutions together with RF and even microwave assemblies – it is especially suited to antenna structures.

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